TSMC’s packaging capacity allocation to chip designer AMD will increase in 2027 while NVIDIA’s allocation drops, according to a report from investment bank Morgan Stanley. AMD’s global CoWoS demand could accelerate to 530,000 wafers in 2026, according to the report, which will mark a 308% annual jump. On the flip side, TSMC’s CoWoS allocation tåo NVIDIA is expected to drop to 45.6% in 2027 from the estimated 53.4% in 2026 as TSMC brings more capacity online to meet the growing global demand for advanced packaging technologies. AMD’s EPYC Server Chips & MI400 AI GPU Ramp Contribute To Growth In CoWoS […]
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