NVIDIA is going to retain its top position as TSMC’s biggest customer in 2027, but AMD EPYC Venice could outpace its Vera CPUs. TSMC Sees Growing 2.5D Advanced Packaging Demand As CPUs Heat Up The Agentic AI Race – NVIDIA Tops The Customer List While AMD EPYC Catches Vera CPUs are quickly becoming the major consumer of advanced packaging technologies as their demand has grown proportionally with the rise of Agentic AI. So far, 2026 has been a roller-coaster ride for the entire tech segment, and 2027 is shaping up to be just as intense. In 2027, major firms will […]
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