The Taiwan Semiconductor Manufacturing Company (TSMC) has achieved 98% yield for some of its CoWoS packaging products, according to the firm’s Vice President of Advanced Packaging Technology and Services, Ho Chun. As reported by the Economic Daily, Ho outlined that the high yield is for several AI-related products packaged through CoWoS and it involves the technology that relies on a 5.5x reticle size. TSMC Plans To Expand CoWoS Technology To 14x Reticle Size By 2029, Says Executive When it comes to manufacturing AI chips, lithography is just one part of the process, even though it might be among the most […]
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