Intel has hired Seok-Hee Lee as EVP of its Foundry’s Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Intel Foundry Gets SK Hynix’s Ex-CEO, Seok-Hee Lee, Bringing Years of Experience In The Advanced Packaging & Back-End Technology Segment Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers. […]
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