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Samsung & SK hynix Reportedly Set To Ramp 8-Layer HBM4 Shipments For NVIDIA’s Rubin Ultra In Q2 2027, As Heat And Yield Issues Continue To Complicate 12-Layer Stack Manufacturing

Three Samsung HBM4 memory chips are placed side by side next to a component labeled 'XPU'.

NVIDIA reportedly entered into discussions with Samsung and SK hynix in the third quarter of 2026 to supply HBM4 memory with 8-layer stacks instead of 12-layer ones, despite a previous update mentioning that Rubin GPUs will stick with the more advanced memory. Fortunately, NVIDIA’s suppliers aren’t expected to completely phase out 12-layer HBM4 and HBM4E DRAM, but Samsung and SK hynix will boost the volume of 8-layer stacks in the second quarter of 2027. No engineering pitfalls are mentioned in the latest report, but a 12-layer HBM4 stack is significantly more difficult to cool compared to 8-layer ones The report […]

Read full article at https://wccftech.com/samsung-sk-hynix-downgraded-hbm4-q2-2027-nvidia-rubin-ultra/