Korean chip giant Samsung might repurpose a production line at an under-construction research and development facility to manufacture base logic dies for its HBM memory chip production. The report comes courtesy of industry sources quoted by ZDNet, and it adds that since the facility’s opening is roughly scheduled in two years, the plans are subject to revision. Samsung Aims To Produce HBM Memory Chip Base Die With 2-nanometer Manufacturing Process Technology For NVIDIA, Says Report The design of HBM memory chips, which are used primarily in AI computing applications, requires multiple DRAM memory chips stacked on top of each other. […]
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