NVIDIA and Tesla have paid Samsung nearly $3 billion to develop substrates for artificial intelligence chips. The technology, called Flip Chip-Ball Grid Array (FC-BGA), flips the die upside down and connects it to the substrate in the package through solder bumps. The technology significantly improves performance over traditional technologies such as Plastic Ball Grid Array (PBGA). The report, courtesy of Maekyung, outlines that the two firms have expressed interest since the technology is the next expected bottleneck in the AI supply chain. Tesla Deepens Cooperation With Samsung To Develop Optimus Humanoid Robot In a chip-on-wafer-on-substrate (CoWoS) package, the FC-BGA technology […]
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