With the demand for its CoWoS chip packaging technology booming, TSMC might be losing some market share to Intel, suggests data from SemiAnalysis Chipbook. CoWoS, which is short for chip-on-wafer-on-substrate (CoWoS), is a key step in the AI chip manufacturing process. It involves combining multiple GPUs and memory chips in a single package, which is then used in a data center or other computing infrastructure. Export Data Suggests Intel Might Be Gaining Market To Meet CoWoS Packaging Shortage While TSMC’s well-oiled chip manufacturing machine has ensured that global AI computing chips, primarily GPUs, have not been in short supply despite […]
Read full article at https://wccftech.com/intel-might-have-gained-ground-on-tsmcs-packaging-dominance-as-booming-ai-demand-overwhelms-the-industrys-undisputed-leader/