One of the more interesting conversations is how China is managing its chipmaking endeavors with the U.S. export controls in place that bar the country from getting its hands on cutting-edge EUV equipment from Dutch manufacturer ASML. This massive roadblock has forced the country’s biggest semiconductor foundries to resort to using multi-patterning techniques with DUV machinery, but German manufacturer Zeiss CEO Frank Rohmund states that this won’t help propel the region from a commercial standpoint. China’s advanced node capability to remain at 7nm at a commercial stage, says Zeiss’ Chief Executive; 5nm is possible, but significantly more complex Strict rules […]
Read full article at https://wccftech.com/zeiss-ceo-says-china-commercial-chip-cannot-happen-without-euv/