TSMC’s CoWoS advanced packaging technology could witness another price increase, with supply chain sources suggesting a hike of up to 20 percent being discussed. The potential premium expected to be slapped on the packaging stems from demand adjustment, as AI chips are pushing the Taiwanese giant’s technology to its limits, with some lead times already lengthened. As more compute dies and HBM stacks are added on a single package, the more complex it becomes, taking longer for TSMC to churn out more units The report from China Times hasn’t been confirmed by TSMC, but it’s no surprise that demand continues […]
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