Chinese memory firm CXMT is facing yield problems with its HBM memory chip production, according to a report in the Korean media. HBM memory chips are significantly harder to manufacture than traditional DRAM modules due to assembly complications. CXMT’s rise in the global memory market has been due to the firm’s ability to supply DRAM modules as the major legacy memory manufacturers focus on HBM production. CXMT Struggling With Through Silicon Vias (TSVs) & HBM Stacking With Yield Stuck At 25%, Says Report While HBM memory chips are built by using DRAM modules, stacking the modules on top of each […]
Read full article at https://wccftech.com/cxmt-faces-hbm-memory-chip-shock-as-yields-sink-to-25-with-close-to-80-out-of-100-hbm3-chips-failing-final-tests-says-report/