NVIDIA’s 35x AI Inferencing Leap Arrives Early As Foxconn Fast-Fowards Groq 3 LPX Racks For Trillion-Parameter ModelsApril 27, 2026
Intel’s Budget Wildcat Lake Chip Beats Apple’s MacBook Neo by 27% in Multi-Core, Matches A18 Pro Single-Thread PerformanceApril 27, 2026
Google Is Reportedly A Major Intel Foundry Customer, Will Use EMIB Advanced Packaging For Next-Gen TPUApril 27, 2026
NVIDIA Taps Taiwanese Nanya Technology’s LPDDR5X Memory For Vera Rubin Platform, Offering 3x Capacity & Over 50% Bandwidth BoostApril 27, 2026
TSMC 3nm & 2nm Wafer Output To Be Boosted By 20% By The End of 2026 As Supply Crunch ContinuesApril 27, 2026
MOREFINE Crams A Desktop RTX 5060 Ti Into A $1,099 Pocket-Sized eGPU With Thunderbolt 5 And OCuLinkApril 27, 2026
Samsung Breaks the 10nm DRAM Barrier With New 4F Cell Structure That Boosts Density By Up to 50%April 26, 2026
NVIDIA Beats Everyone To DeepSeek V4 With Day-0 Blackwell Support, Pushing 3,500 Tokens Per Second On 1.6T ModelsApril 26, 2026
3D X-DRAM Hits Proof-of-Concept, HBM-Replacement with 10x Density vs Traditional DRAM & High-Yield Memory DesignApril 26, 2026
Samsung Strike Could Deepen DRAM Crunch And Cost $20 Billion As An 18-Day Walkout Risks Becoming a 36-Day Production BlackoutApril 25, 2026
ASUS Finally Puts A Price On Its ROG Equalizer Cable, And $50 Is Surprisingly Reasonable For Saving An RTX 50 GPUApril 25, 2026
AMD Goes Bigger With EPYC Venice and Verano, with New SP7 and SP8 Sockets Dwarfing Today’s SP5 and SP6 PlatformsApril 25, 2026
Intel Rewrites Its Five-Year Desktop Gaming Roadmap to Chase AMD’s X3D Lead, Betting on Software Big TimeApril 25, 2026
TSMC’s Key CoWoS Packaging Supplier Drags Ex-General Manager to Court While Denying Any Tech Reached ChinaApril 25, 2026
