Intel is rapidly working on its advanced packaging capabilities, now reportedly partnering with AU Optronics for CPO & massively integrated chips. AU Optronics & Intel Are Combining Their Advanced Packaging Capabilities To Fuel The Era of CPO (Co-Packaged Optics) & Beyond The future demands a vast acceleration in the field of advanced packaging to sidestep the slowdown of Moore’s Law. Advanced Packaging solutions are a necessity in the modern world as AI and compute demands swell intensively. Given this demand, Intel is reportedly planning to join hands with Taiwanese Optoelectronics giant AU Optronics, or AUO. As a part of this […]
Read full article at https://wccftech.com/au-optronics-intel-reshape-chip-packaging-merging-micro-led-displays-with-silicon-cpos/