The fates appear to have turned benevolent towards Intel, especially as its multi-year strategic pivots are now finally on the cusp of paying financial dividends, as evidenced by the chipmaker’s rapidly expanding EMIB-T capacity as well as its hefty lead against Samsung and TSMC on high-NA EUV technology. UBS now believes Intel can easily meet MediaTek’s growing TPU-related demand for EMIB-T advanced packaging, replete with the ability to package over 2 million substrates by 2028 According to UBS, the wider industry is becoming increasingly optimistic on Intel’s EMIB-T, especially in relation to its execution strategy and yields on the advanced […]
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