China’s Naura Technology Group, a key domestic semiconductor manufacturing equipment provider, claims to have developed a two-step etch process for manufacturing 3D DRAM chips. 3D DRAM chips are the next generation of DRAM technology as they seek to overcome the constraints of current chips when it comes to cell density. A paper published by Naura in the IEEE journal explains progress made in etching uniformly across the 64 layers of 3D DRAM to shift the focus to vertical manufacturing instead of the horizontal constraints encountered by non-EUV lithography. Chinese Chip Equipment Manufacturer Naura Details Breakthrough In Semiconductor Etch Engineering That […]
Read full article at https://wccftech.com/chinese-chip-making-equipment-firm-naura-claims-big-breakthrough-that-could-enable-cxmt-to-overcome-euv-sanctions-make-3d-dram-chips/