TSMC is the undisputed king of the global semiconductor market, and to extend its lead, it has succeeded in developing cutting-edge lithography and advanced packaging. Samsung certainly has a lot of ground to cover in this aspect, but its strengths lie in being able to secure partnerships beyond its 2nm contracts, which have ultimately led to a mammoth $200 billion agreement with Broadcom to build next-generation AI infrastructure over the next five years. The major payoff will include Samsung’s 2nm process and HBM4 memory that Broadcom will use for its AI accelerators Given that memory and storage have already established […]
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