Onsemi’s EPP (Embedded Power Platform) aims to utilize silicon wafers to enable more efficient and power-dense chips. As Power Demands Grow, Onsemi Is Working on Its EPP Solution To Make Semiconductors More Efficient & Denser Currently, power modules within a chip are placed within the PCB (Printed Circuit Board), but as more advanced packaging solutions are being developed, we are seeing the embedding of power systems within the package substrate. Intel’s EMIB is one example where the TSVs route power to the chip around the embedded package, and EMIB-T takes it one step further by routing power through the embedded […]
Read full article at https://wccftech.com/onsemi-ditches-traditional-pcb-substrate-for-silicon-wafer-unlocking-5x-power-density/