Micron has just taken a cudgel to the memory cell miniaturization advantages that supposedly ensue from a 4F² architecture, even as YMTC prepares to follow CXMT’s lead by going all in on this technology to try to overcome its DUV lithography-based constraints. Barred from the Western EUV lithography tech, CXMT and YMTC have no option but to try to make the 4F² memory cell architecture work, while Micron eyes greener pastures in the 3D DRAM sphere As a refresher, the 4F² process is a next-generation memory cell architecture, where the components of a single memory cell (one transistor and one capacitor) are […]
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