TSMC has plans for dedicated chip fabs in the US, but a more important one is creating advanced packaging facilities, which seems to be the next goal of the Taiwan giant. TSMC to Produce Cutting-Edge CoWoS, SoIC & CoW Packaging Technologies in America, Reducing Taiwan Dependency Since the Trump presidency, TSMC has expanded its efforts to produce in America on a massive scale, mainly driven by the firm’s $100 billion investment in the region, including opening up chip facilities, R&D centers, and advanced packaging facilities. Next to chip production, advanced packaging like CoWoS is one of the most essential elements […]
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