TSMC’s advanced packaging capacity is ‘fully booked’ at the moment, which is a huge concern for the AI industry, but it appears that the Taiwan giant has a strategy in sight. TSMC’s ‘CoWoS’ Production Lines Have No Room For Further Orders, As the Firm Now Relies on Outsourcing Advanced packaging has been the ‘holy grail’ for manufacturers when it comes to combining multiple chiplets to scale up the performance of their AI chips, which is why solutions like TSMC’s CoWoS are experiencing peak interest from companies such as NVIDIA, AMD, Google, Apple, MediaTek, and many more. However, based on supply […]
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