TSMC has presented its latest technology roadmap through 2029, bringing advanced processes such as A13 and A12 by 2029. TSMC Reluctant To Use ASML’s Advanced EUV Machines Due To Cost Constraints, Focuses On Die Shrinks For 2029 With A13 & A12 During TSMC’s 2026 North American Technology Symposium, the company presented its latest roadmap, which includes some major updates. These new processes will offer a further refinement, such as savings in area size, and the utilization of new technologies. Starting with the roadmap itself, following the mass production of its N2 process technology, which is expected in the first products […]
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