With TSMC’s CoWoS advanced capacity egregiously constrained, and Intel’s more nimble EMIB attracting a growing volume of orders, the Taiwan-based chipmaker has realized that it needs to change course to retain its competitive edge. And, it has chosen to do so by attempting to clone some elements of Intel’s novel approach to advanced packaging, as per the reporting by The Information. Apparently, the new packaging project is referred to internally at TSMC as a “quasi-EMIB,” borrowing heavily from Intel’s novel approach For the benefit of those who might not be aware, TSMC’s Chip-on-Wafer-on-Substrate (CoWoS-S) packaging solution uses large, expensive silicon […]
Read full article at https://wccftech.com/tsmc-concedes-intels-emib-packaging-is-a-potent-contender-starts-building-quasi-emib-as-cowos-remains-choked-through-2026/