SK hynix, a prominent memory manufacturer, has unveiled plans to build advanced packaging production lines in South Korea to meet the growing demand. SK hynix Plans to Invest Up to $13 Billion into Advanced Packaging Lines in South Korea, Alongside Its M15X Fab Advanced packaging is emerging as one of the significant bottlenecks in the AI supply chain, as companies have based their chip portfolios on this technology, and current production lines are insufficient to meet demand. Technologies like CoWoS enable firms like NVIDIA/AMD to integrate HBM modules directly onto the main compute die. This is why, for memory manufacturers […]
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