Samsung is all set for its next-gen HBM5 development as it is planning to integrate a new thermal feature called “HPB” to its upcoming DRAM standard. Samsung Previews The Design & Features of Its Next-Gen HBM5 Memory As It Races Against SK Hynix & Micron We know that Samsung, SK Hynix, and Micron are all working on future HBM standards. These three DRAM makers are currently supplying the bulk of the DRAM to chipmakers who are powering the latest AI datacenters across the world. Most recently, SK Hynix introduced a new feature for its HBM products called iHBM, which embeds […]
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