Korean chip giant Samsung is likely to start mass producing chips with hybrid bonding by the end of the decade, according to Korean industry sources. Hybrid bonding, which relies on removing the micro bumps in individual DRAM layers when manufacturing high bandwidth memory (HBM), is widely believed to be the next-generation HBM manufacturing technology due to its ability to reduce the space between the layers and offer superior performance. Samsung Likely To Introduce Hybrid Bonding With NVIDIA’s Feynman AI Chips, Believe Sources NVIDIA’s Feynman AI GPUs are slated to follow the Rubin Ultra chips, and NVIDIA shared quite a bit […]
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