The Taiwan Semiconductor Manufacturing Company (TSMC) is planning to increase its 3-nanometer and 2-nanometer manufacturing process technology capacities in 2027, suggests a supply chain report from Taiwan. TSMC, the world’s leading contract chip manufacturer, is facing high demand from the AI buildout and high-performance computing (HPC) chips. Its 2 and 3-nanometer technologies are the most advanced in its portfolio, with earlier reports having suggested that the next-generation 1.4-nanometer technology could enter production in 2027. TSMC To Bump 2-nanometer & 3-nanometer Production Capacity By 22% and 16% By Mid-2027, Says Report Over the past couple of weeks, several reports have discussed […]
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