Qualcomm has reportedly placed “advanced packaging” orders at UMC, taking the first step towards challenging TSMC’s dominance in this particular segment. Qualcomm Becomes The First Tech Giant To Place Advanced Packaging Orders At UMC, Possibly Setting a New Trend For those unaware, TSMC has been the leading company in catering to advanced packaging or “CoWoS” orders for industry giants, but it looks like a new competitor has stepped into the scene, seeing adoption from Qualcomm. UMC, or United Microelectronics Corporation, has reportedly bagged an advanced packaging order from the San Diego chipmaker, according to Taiwan Economic Daily, where Qualcomm is […]
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