As multiple reports claim that Intel is aggressively marketing its EMIB-T packaging technology to AI chip designers in order to shape itself as an alternative to TSMC’s CoWoS packaging technology, another customer that it might land could be NVIDIA, according to UBS. The details suggest that a 4-chip variant of the Rubin chip could use Intel’s EMIB-T packaging process instead and provide the chip manufacturer with an important role in NVIDIA’s and the artificial intelligence supply chain. Intel Purportedly Manages To Rein In NVIDIA As Key Customer For EMIB-T Packaging One of the key advantages of the EMIB packaging technology […]
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