NVIDIA has reportedly been considering CoWoP as its next packaging solution, possibly being used by its next-gen Rubin GPUs. NVIDIA Rubin GPUs Could Utilize CoWoP Packaging Solution Instead of CoWoS CoWoS or Chip-on-Wafer-on-Substrate is the go-to packaging solution for modern-day HPC and AI chips. This technology made its first debut almost 14 years ago, and is currently used by NVIDIA’s and AMD’s AI powerhouses. The other crucial thing about CoWoS is that it is a mature packaging technology with a robust supply chain that comprises various partners. So one can’t go wrong with CoWoS, but it looks like AI giants […]
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