Taiwanese fabless semiconductor firm MediaTek has made a major claim at the Goldman Sachs Taiwan Day by outlining that for its next-generation program, it plans to only use Intel’s EMIB-T packaging technology. The Taiwanese supply chain has been discussing EMIB-T regularly for months now, and MediaTek is Google’s partner for the next-generation TPU custom AI chips. Intel has positioned EMIB against TSMC’s CoWoS packaging technology, and MediaTek’s announcement marks a strategic win for the American chip company, whose CEO has aggressively targeted the AI industry as part of his turnaround efforts. Intel Might Have Won MediaTek Over From TSMC’s CoWoS […]
Read full article at https://wccftech.com/mediatek-says-its-next-gen-program-will-only-use-intels-emib-t-for-packaging/