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JEDEC Moving Towards HBM4 Spec Finalization: Up To 32 Gb Densities In 16-Hi TSV Stacks, 6.4 Gbps Speeds

Samsung & SK hynix Eye 1c DRAM As The Choice For HBM4 Memory, TSMC Preps HBM4 Base Dies On 12nm & 5nm 1

JEDEC has unveiled the initial specifications of HBM4 as the highly anticipated memory standard nears completion & ultimately enters mass production. HBM4 Is Set To Bring In Massive Memory Capacities, Up To 32 Gb Densities In 16-Hi Stacks The semiconductor and memory industries are all focused on HBM4, the memory type expected to elevate the performance of associated products to new levels. The HBM adoption rate has soared massively in the past year simply due to the demand from the AI markets for products utilizing the memory type, such as AI accelerators. This has not only fueled firms to upscale […]

Read full article at https://wccftech.com/jedec-moving-towards-hbm4-spec-finalization-up-to-32-gb-densities-in-16-hi-tsv-stacks-6-4-gbps-speeds/