With aggressive AI demand burdening TSMC’s packaging resources, supply chain reports from Taiwan continue to suggest that Intel’s EMIB-T packaging technology is gaining traction with Google. Intel has marketed EMIB, short for Embedded Multi-die Interconnect Bridge, as an alternative to TSMC’s Chip-on-Wafer-on-Surface (CoWoS) technology to assemble AI GPUs with components such as memory. Google is expected to be a major EMIB customer, and today’s report suggests that additional firms might also be playing a role in the technology’s adoption for Google’s next-generation custom tensor processing unit (TPU) custom AI chips. Intel’s EMIB-T Development Sees Taiwan’s Powerchip Semiconductor & AP Memory […]
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