Intel has showcased its packaging prowess with a multi-chiplet product featuring 18A/14A node tiles, Foveros 3D & EMIB-T technologies. Intel Is Indeed Cooking With Its Next-Gen 18A/14A Process Nodes, Foveros 3D & EMIB-T Technologies: Showcases Conceptual & Highly-Scalable Designs With Up To 16 Compute Tiles, 24 HBM Sites & A Lot More Intel is holding back on its advanced packaging solution and has just showcased what the future holds for customers who aim to utilize its technologies in building future chips. These technologies will be setting the standard for next-gen chips for HPC, AI, Datacenters, and more. Intel’s Advanced Packaging […]
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