At the 26th China International Industry Fair in Shanghai, Langdao Silex, a Chinese technology startup, revealed its self-developed EUV light source prototype called the “FlintNano LPP-OXXO.” Being a core component of EUV lithography, the company states that it has secured most core components through independent R&D, with a localization rate of approximately 90%. Hearing this development could signal that China is ready to call it quits on ASML, but here’s why we wouldn’t jump to conclusions. Mass production isn’t expected for the next 3-5 years, and that’s likely an optimistic timeline; ASML currently has U.S. trade restrictions to worry about […]
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