China’s semiconductor industry might have taken one of its most significant technological leaps, as a report claims that the nation has built the first domestic EUV prototype. China’s EUV Prototype Is Expected to Tape-Out Chips By 2030, Built by Older Parts of ASML’s Machine Beijing has been pushing towards an EUV breakthrough for several years now, with firms like SMIC attempting to replicate ASML’s technology by reverse-engineering and poaching talent. Now, Reuters has disclosed that efforts over the years have paid off in China’s favour, as the report claims that the nation has developed an EUV lithography prototype, which is […]
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