IBM Power11 CPU Brings 2.5D Stacking On Enhanced 7nm Node From Samsung, Higher Clocks, Memory UpliftsAugust 26, 2025
NVIDIA’s ConnectX-8 Is A SuperNIC Designed For Blackwell Systems With PCIe G6 & 800GbE SpeedAugust 26, 2025
Huawei Is Reportedly Designing an ‘AI Memory’ That Could Replace HBM, Reducing the Firm’s Dependence on the WestAugust 26, 2025
Intel Bundles Battlefield 6 With Arrow Lake, And Raptor Lake/Refresh CPUs In Intel Gamer DaysAugust 26, 2025
Big Tech’s Frenzy for TSMC’s ‘Made in USA’ Chips Has Forced the Company to Rush Overall Production Ahead by a Whopping Four QuartersAugust 26, 2025
AMD’s FSR 4 Brings Exceptional Visual Enhancements With the Radeon RX 9070 XT GPU, But You Might Need to Settle for Lower FPSAugust 26, 2025
Intel’s Next-Gen Clearwater Forest “E-Core” Xeon CPU Unveiled: 12 CPU Chiplets On 18A Node, 288 Darkmont Cores, 17% IPC Increase, 2x L2 Cache Bandwidth, DDR5-8000 SupportAugust 25, 2025
Teardown Reveals Huawei’s Fastest Server Chip, the Kunpeng 930, Built on TSMC 5nm With 120 TaiShan CPU Cores and 364MB L3 CacheAugust 25, 2025
NVIDIA to Develop Japan’s Most Powerful AI Supercomputer, ‘Fugaku NEXT,’ Bringing Up to 100x Generational Increase In Application PerformanceAugust 25, 2025
Google Provides Detailed Insight on Next-Gen “Ironwood” TPU Superpod: 9216 Chips, 192GB HBM Memory & 4614 TFLOPs Compute Per ChipAugust 25, 2025
Intel Panther Lake CPUs With Up To 16 Cores Featured on ADLINK’s SFF Motherboard: 65W TDP & LPDDR5X-8533 SupportAugust 25, 2025
SK hynix Is Now Mass Production 321-Layer QLC NAND Flash, Coming First To PCs With Up To 32-Layer StackingAugust 25, 2025
NVIDIA Dives Into Technical Details of Its Blackwell GB200 & GB300 NVL Racks, Trays & MGX’s Open Compute CommitmentsAugust 25, 2025
