Huawei’s “Next-Gen” Ascend 910D Chip To Disrupt NVIDIA’s Position In Chinese AI Markets; Set To Rival Against Hopper H100April 27, 2025
GAMEMAX Debuts Blade Concept Edition Chassis; An ATX Tower With Innovative And Open-Air DesignApril 27, 2025
GeForce RTX 5070 Ti With SK Hynix GDDR7 Memory Overclocked To 34 Gbps; Delivers 7% Performance UpliftApril 27, 2025
PELADN Launches YO1 Mini PC, Featuring 16-Core Ryzen AI Max+ 395 CPU And 128 GB System Memory In A Compact ChassisApril 27, 2025
DeepSeek R2 AI Model Rumors Begin to Swirl Online; Reported to Feature 97% Lower Costs Compared to GPT-4 & Fully Trained on Huawei’s Ascend ChipsApril 27, 2025
AMD’s RDNA 4 “Laptop” GPUs Surfaces Online; Flagship Radeon RX 9080M To Feature 64 Compute Units & 16 GB Memory OnboardApril 26, 2025
Google Has Reportedly Ditched Samsung’s HBM3E Process As It Fails To Pass NVIDIA’s Qualification Tests; Switches To Micron InsteadApril 26, 2025
MSI Titan 18 HX AI Laptop Review: Brutally Powerful With Intel Core Ultra 9 285HX & NVIDIA RTX 5090 24 GBApril 26, 2025
Gigabyte Addresses Thermal Gel Leakage in RTX 50 Series GPUs, Explains It Was Caused by Applying a “Higher Volume” of GelApril 26, 2025
AMD AGESA 1.2.0.3C BIOS Addresses “Ryzen 9000” Vulnerability On AM5 Platform, MSI First To Roll Out For Its LineupApril 25, 2025
Intel Admits Recent CPU Launches Have Been Disappointing To The Point That Customers Now Prefer Previous-Gen Raptor Lake ProcessorsApril 25, 2025
Intel’s CEO Lip-Bu Tan Reportedly Met With TSMC’s CEO To Discuss Foundry Partnership; Raising Possibility of a DealApril 25, 2025
Global PC Shipments Saw A Good 6.7% Year-on-Year Growth In Q1 2025 Despite Looming US TariffsApril 25, 2025
TSMC’s Cutting-Edge SoW-X Packaging Set For Mass Production By 2027; Delivering 40x Higher Computing Power Than Current CoWoS SolutionsApril 25, 2025
NVIDIA, Broadcom, Faraday & Many ASIC Clients Are In Pursuit Of Intel’s 18A Process; Chip Sampling Shows Impressive ResultsApril 24, 2025
