Cadence and TSMC are expanding their collaboration by achieving tool certification for the next-gen A14 process technology. Cadence Achieves TSMC A14 Tool Certification, Enabling Agentic AI Chip & 3D-IC Design Flows Across N3, N2, A16, A14 and 3DFabric Processes Press Release: Cadence today announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s advanced A14 process, demonstrated an industry-leading UALink solution in TSMC N3P, and introduced new silicon-proven IP for N3P and N2P technologies. Through this partnership, the companies are enabling agentic AI chip and 3D-IC design flows across TSMC’s N3, N2, […]
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