Broadcom has unveiled its “cutting-edge” 3.5D XDSiP platform technology, focused on custom compute platforms to bring in significant performance and efficiency gains. Broadcom’s Newest 3.5D XDSiP Platform Brings In Enablement For Large-Scale AI XPU, Focusing On AI & HPC Workloads [Press Release]: Broadcom Inc. today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 mm² of silicon and up to 12 high bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at […]
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