AMD’s newest patent filing has revealed that the firm is looking towards adopting “multi-chip stacking” in its future Ryzen SoCs, leading towards die scalability. AMD Might Implement “Overlapped” Chip Stacking, Using Smaller Chiplets Underneath A Larger Die, All In A Single Package Team Red is always in pursuit of innovating its existing consumer CPU lineup, as the firm is the first manufacturer to introduce a dedicated “3D V-Cache” tile to its processors, known as the “X3D” lineup. Now, according to a new patent filing (via @coreteks), it is being said that AMD is reportedly exploring a “novel packaging design”, which […]
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