TSMC’s CoWoS and other advanced packaging solutions might witness massive production slowdowns, as a key Japanese supplier is cutting production of a vital essential. TSMC’s CoWoS & Other Advanced Packaging Solutions Could See a Disruption In Production, As Demand Reaches a New High TSMC’s CoWoS packaging has been an integral part in developing capable AI hardware such as accelerators from NVIDIA, given that through it, companies have managed to bring in performance in prominent figures by stacking multiple chiplets. However, it is rumored that the AI supply chain might lead to exhaustion, as advanced packaging production could see a compromise. […]
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