When news first emerged earlier this week that TSMC was apparently entering the 3D DRAM business, it was trumpeted as a definitive proof that the memory sphere had finally graduated beyond its dreaded commodity status. Then, TSMC dashed that budding euphoria by issuing a rambling denial. And yet, the very wording of that statement gives us cause to continue to expect some movement on this front, especially as the world’s largest contract chip manufacturer is already working on a novel Back-End-Of-Line (BEOL) memory solution that might render the SRAM obsolete. TSMC’s BEOL memory solution can take advantage of the larger […]