Intel’s vice president and general manager for manufacturing development and customer engagement, Chris Auth, believes that his firm is better suited to using High NA EUV lithography machines than TSMC. Auth made the remarks during the Dwarkesh podcast, where he explained that since Intel relies on backside power delivery on its products, it can print circuits directly with High NA EUV. The podcast also features the firm’s chief technology officer (CTO) Pushkar Ranade, who explained that catching up with TSMC was a matter of scale and not technology. Intel VP Says Backside Power Delivery Enables Firm To Use High NA […]
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