Korean memory giant SK hynix, which is among the earliest firms to make high-bandwidth memory (HBM), is reportedly consulting supply chain partners for its next-generation HBM memory called iHBM. HBM memory chips stack layers of DRAM on top of each other and a base die, which leads to heat dissipation problems since the heat sink or the liquid cooler sits at the top of the stack. To overcome these limitations, SK hynix has integrated cooling elements directly into the HBM package to improve heat dissipation. SK hynix Reportedly Enters Into Discussion With Industry Partners For iHBM Memory Chips HBM chips […]
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