Huawei’s LogicFolding tech, while borne out of its sanction-laden realities, and quite innovative all things considered, is no match for the process miniaturization-led advancements that Qualcomm and Apple continue to pursue for their mobile SoC. This is partly a function of the thermal tax that LogicFolding imposes on clock speeds, as recently explained by a semiconductor expert. Huawei’s LogicFolding imposes thermal constraints on clock speeds, while requiring active cooling capabilities, diminishing its attractiveness for Qualcomm and Apple As we noted last week, Kurnal Insights has now published the die shots for Huawei’s Kirin 9050 Pro chip, showing a compute die and […]
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