The Taiwan Semiconductor Manufacturing Company (TSMC) might double its chip-on-wafer-on-substrate (CoWoS) capacity from 2026 levels in 2028, suggests a report from the Taiwanese media. TSMC’s CoWoS is the leading packaging technology for AI GPUs and is used by major firms such as NVIDIA. The details suggest that the capacity expansion comes at a time when existing constraints have led to a spillover to other firms, such as Taiwan’s UMC and Amkor. Intel Expected To Reach Up To 45,000 Wafers Per Month Of Equivalent CoWoS Capacity In 2028, Says Report The booming demand for TSMC’s CoWoS technology and the resulting shortage […]
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