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SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future

A slide titled 'Advanced PKG Future Direction' illustrates three structures: '2D Structure' with 'PKG to PKG on Board,' '2.5D Structure' with 'Die to Die on Interposer,' and '3D Structure' with 'Die on Die,' each depicted with different chip designs and connections.

SK Hynix is leveraging advanced packaging technologies such as Intel’s EMIB for its next-gen HBM solutions, which will eventually enter the 3D packaging stage. Scaling HBM Comes With Big Challenges & SK Hynix Is Leveraging Advanced Packaging Solutions To Address Them As It Ventures Into The 3D Era At Hot Chips 2026, Jaesik Lee of SK Hynix presented the “Advanced Packaging for High-Bandwidth Memory” brief, which talks about how the company plans to leverage advanced packaging tech to accelerate its HBM roadmap. The company started by presenting how HBM is currently built. The HBM structure consists of a 3D stacked […]

Read full article at https://wccftech.com/sk-hynix-advanced-packaging-technologies-intel-emib-next-gen-hbm-memory/