Samsung presents a bold vision for evolving the HBM base die with advanced logic processes that reviews the architecture’s bandwidth and power challenges, then outlines a three-phase roadmap, from area reclamation and functional expansion to full 3D ZHBM integration, that transforms the base die into an intelligent partner for next-generation AI systems. Samsung Charts Three-Phase HBM Roadmap Toward True 3D ZHBM That Stacks DRAM Directly On Compute For AI In the presentation by Sangwook Han, who is part of Samsung’s DRAM Design Team, the main discussion revolves around the evolution of HBM using advanced logic processes, with the HBM base […]
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