Intel appears laser-focused on operationalizing its new Ohio fab complex by 2031, and is willing to award generous bonuses to achieve that overarching goal. Meanwhile, the tailwinds also appear to be aligning on Intel’s EMIB-T packaging, with only the substrate yields now left as the sole unsolved piece of the puzzle. Disparate tailwinds are finally beginning to coalesce for Intel, indicating that its Ohio fab remains on schedule, and its EMIB-T advanced packaging is now poised to challenge TSMC’s CoWoS-L For the benefit of those who might not be aware, Intel is building a gigantic 1,000-acre fab complex in Ohio […]
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