Chip manufacturing giant Intel is considering deploying front and back side power delivery for its 1.4A manufacturing technology due to patterning errors in lithography, says a report. The limitations in lithography stem from the firm’s need to catch up with Taiwan’s TSMC and Samsung Foundry for transistor density on the 1.4A node. Through its 1.4A2 process, the firm aims to compete with TSMC’s N2 and Samsung’s SF2Z chip manufacturing process technologies. Finer Circuit Size Forces Intel To Choose Dual Power Delivery For 1.4A2 Manufacturing Process, Says Report In chip fabrication, power delivery typically occurs through the back side in order […]
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